Note: For device drying or baking conditions, please refer to the higher temperature (125C +/10C, <5% RH) User Bake conditions stipulated in J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices.
If you do not know the device family, product line and IC packaging of the product, type in the part number in the search query on the top of this page. If it is a valid part number, then the search result returns the information you need. A RoHS-compliant part number is denoted by the suffix "N".
Moisture/Reflow Sensitivity Classification
If a device is classified as MSL 1, it is not moisture sensitive and the device does not have to be dry packed again after the pack has been opened.
If a device is classified at a higher numerical level, it is moisture sensitive and must be dry packed in accordance with J-STD-033.
If a device is classified as Level 6, it is extremely moisture sensitive and the dry pack will not provide adequate protection. Please refer to Intel® packing label on the baking time before reflow soldering.