PhysicalConstantsofICPackage Materials

PhysicalConstantsofICPackage 
Materials

PhysicalConstantsofICPackage Materials

5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Thermal Conductivity (20°C) Coefficient of Thermal Expansion Electrical Resistivity Dielectric Constant (1 MHz) Flammability Rating * NOTE: 1. *... UL-94V-0 Units 3 kg/m (g/cc) GPa Alumina (92%) 3600- 3700 (3.6-3.7) 55 MPa W/mK 157 18 Kovar 8400 (8.4) 138 627 17.5 Molding Compound 1790-1850 (1.79-1.85) Sealing Glass 4700 (4.7) E = 11.7 1 E = 0.1 2 19.98 0.58 -0.67 5.7 0.6 Cu-W (90%) 17000 (17) 255 180 - 200 Cu 8900 (8.9) 125 270 ppm/ °C W cm 6.8 (25° C - 400°C) 5.3 (40°C - 250°C) 14 10 7.9 - 10.0 -6 49 X 10 NA a < 23 1 a < 80 2 (40°C - 250°C) 12 5 X 10 < 5.0 6.3 - 7.0 (40°C - 250°C) 11 >10 11.5 6.5 (25°C - 500°C) 16 (25°C - 500°C) -6 <6 X 10 NA -6 <2 X 16 NA inches 1/8 Table 5-2. Lead/Lead Frame Characteristics Properties Density Modulus of Elasticity Tensile Strength Thermal Conductivity (20°C) Coefficient of Thermal Expansion Electrical Resistivity Units 3 kg/m (g/cc) GPa MPa W/mK ppm/ °C W cm Copper Alloy MF 202 8880 (8.8) 113 490-590 160 Alloy 42 8100 (8.1) 145 588-735 15.7 Kovar 8400 (8.4) 138 627 17.5 TAMAC5 CDA 194 8900 8800 (8.9) (8.8) 120 121 527-562 480-519 138 263 OLIN 7025 8800 (8.8) 131 527 166 EFTEC 64T 8900 (8.9) 119 560 300 17.0 4.5 5.3 16.7 16.3 17.1 17.0 -6 5.7 X 10 -6 57 X 10 -6 -6 -6 49 X 10 4.9 X 10 2.6 X 10 -6 4.3 X 10 -6 2.3 X 10 2000PackagingDatabook 5-1 PhysicalConstantsofICPackageMaterials Table 5-3. Solder Material Melting Temperatures Solder Type Sn-Pb Plating (85 wt% Sn) Sn-Pb Eutectic (62 wt% Sn) Tin Lead Gold Copper Silver Copper/Silver Braze (28 wt% Cu) Au-Sn Eutectic (80 wt% Au) Table 5-4. Die Attach Material Characteristics Temperature (°C) 200 - 225 183 232 327 1063 1083 961 850 280 Property Density Modulus Elasticity Tensile Strength Thermal Conductivity Coefficient of Thermal Expansion Electrical Resistivity Units 3 kg/m (g/cc) GPa MPa W/mK ppm/°C W cm Silver Filled Glass 4500 (4.5) > 10. 270 8 -5 1 X 10 Silver Filled Adhesive 0.77 2.5 @ 121°C a = 40 1 a = 150 2 -4 1 X 10 Silver Filled Epoxy 2500 (2.5) 1.6@ 121°C a = 46 1 a = 240 2 -4 2 X10 99.99% Au + 2% Si 99.99% Au 14500 (14.5) 69.5 (Data for Au + 3% Si) 500-600 50 19300 (19.3) 62.5 130 311 50 @ 25°C -4 3.1 X 10 14.2 @ 25°C-6 2.21 X 10 Table 5-5. TCP Package Materials Characteristics Property Density Modulus Elasticity Tensile Strength Thermal Conductivity Coefficient of Thermal Expansion Electrical Resistivity Dielectric Constant Units 3 kg/m (g/cc) GPa MPa W/mK Polyimide 1470 (1.47) 9 @ 25°C 4 @ 300°C 400 0.2 Adhesive 1500 - (1.5) 8@ Read the full PhysicalConstantsofICPackage Materials.

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