IXP43X Product Line Thermal Design Application Note
The document describes thermal design and characteristics of the IXP43X product line of network processors and suggests solutions for adequate cooling to maintain case temperature at optimal levels.
Read the full IXP43X Product Line Thermal Design Application Note.
Demonstrates attachment of strain gauges to measure manufacturing board flexure. (v.1, Jan. 2011)
Tech leaders discuss the power of connecting billions of devices to extract greater big data insights.
Demonstrates verification using turbo mode gadget and frequency display utility. (v.1, Oct. 2010)
Demonstrates how to use open source hypervisor, Xen* 3.0, and CentOS* 5.5. (v.1, Oct. 2010)
Demos setup, software, oscilloscope settings, and power delivery assessments. (v.001, Mar. 2010)
Demo: Walks through key features and use of the planner to create boards. (v.2, Sept. 2013)